For dosing applications in the electronics industry
In electronics manufacturing, components involved in the production process must above all provide maximum precision and reliability. Today, microchips are used in practically all electrical devices and they are becoming ever more complex and powerful. ViscoTec dosing systems, which work according to the endless piston principle, offer the ideal properties to ensure that all relevant applications in the electronics industry are perfectly dosed.

  • Conformal coating>

    Conformal coating

    A conformal coating is a protective coating which takes the form of a non-transparent or transparent varnish that is applied to all or parts of PCBs. The materials are usually high-viscosity thermal or UV-curing materials and are dosed onto the PCB using either a thin-film or a thick-film procedure.

  • Dam & fill>

    Dam & fill

    In dam & fill applications, the primary aim is to protect highly complex assemblies. Firstly, a high-viscosity barrier, known as the “dam”, is applied to the surface to be sealed. Then the adjacent area is filled with a filler and the area being dosed is sealed and protected by the fluid material.

  • Glob top>

    Glob top

    Glob-top potting is designed to protect sensitive components, usually semiconductor chips, from mechanical stress such as vibrations or fluctuations in temperature. External environmental factors too, like moisture or corrosion, are thus prevented from having an impact on the potted components. This effect is realized by applying a fluid resin matrix, mostly an epoxy resin adhesive, which is then cured.

  • Micro-dosing>


    Micro-osing refers to the dosing of fluid media in volume ranges of just a few microlitres. Other fields of application are, for example, bead dosing, sealing, dot dosing, potting and 2-component applications. These applications in particular call for high levels of precision, repeat accuracy and reliability.

  • Optical bonding>

    Optical bonding

    Optical bonding is a process in which a clear adhesive is applied between the layers of glass in a touch-screen display. The main goal of this bonding process is to improve the performance of the display when outdoors. This procedure eliminates the gap between the glass and the display. A great deal of importance is placed on dosing precision in the field of smartphone and tablet manufacturing in particular.

  • Underfill>


    Underfill applications are usually utilised with isotropic conductive adhesives. The isotropic conductive adhesive establishes the electrical connection between the microchip and the substrate. Since this adhesive is not applied over the entire surface, once it has cured (either thermally or by means of UV radiation), the hollow space needs to be refilled, or “underfilled”.

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